Moldflow Plastics V2007 英文正式版(設計分析解決方案)
碟片編號：CID1803
碟片數量：1片
銷售價格：80
瀏覽次數：7374
破解說明:安裝前請先詳細閱讀MAGNiTUDE資料夾內readme.txt檔，即可完成安裝。
軟體簡介:
Moldflow Plastics V2007 英文正式版(設計分析解決方案)
內容說明:
Moldflow Plastics Insight 軟體套件是在對驗證零件和模具設計進行深入模擬方面世
界領先的產品。全世界的公司都已選擇 Moldflow 的解決方案，這是因為它們可提供：
獨特的、獲得專利的熔解技術
MPI/Fusion 是基於 Moldflow 的獲得專利的 Dual Domain? 技術，它使您能夠直接分析
薄壁零件的 CAD 實體模型，這樣可以明顯降低模型準備的時間。時間的節省使您能夠分
析更多設計迭代以及執行更深入的分析。
功能強大的工作流和生產力工具
MPI 中的用戶友好的環境使用可視化和工程管理工具，該工具使您能夠進行範圍很廣的
設計分析和優化。分析完成之後，您可以快速而又輕鬆地生成詳細的、可在網上使用的
設計報告。
經證實的可用於所有類型應用程式的解決方案
Moldflow 的分析產品可以模擬塑料流動和保壓、模具冷卻和零件收縮和翹曲，以進行熱
塑料性注塑成型、氣體輔助注塑成型、連續注塑成型和注塑壓縮成型過程。其他的模組
模擬反應注塑成型過程，包括熱固性和橡膠注塑成型、反應注塑成型 (RIM)、結構化反
應注塑成型 (SRIM), 塑脂傳遞注塑成型、微晶片封裝和底部灌充（倒裝晶片）封裝。
世界最佳的 3D 解決方案
通過使用基於實體四面體的有限元體積網格的經證實的解決方案技術，MPI/3D 能使您能
夠對非常厚的實體執行真正的、三維的模擬，同時也可以模擬有非常大的厚薄變化的實
體。
支援的幾何體類型範圍最廣
Moldflow 的 MPI 技術可以在所有 CAD 模型幾何體類型上實施，包括傳統的中平面模型
、線框和表面模型、薄壁實體和厚的或不同中平面的實體。不管您設計的是何種幾何體
，您都可以在一個可處理模型的易於使用的、一致的、集成的環境中完成模擬任務。
超群的網路計算選項
Moldflow Plastics Insight (MPI) 是使用網路計算環境開發出來的。例如，用戶可以
在用戶友好的 Windows PC 運行 MPI/Synergy、前處理器和後處理器，這樣可以在強大
的 UNIX 工作站上運行分析求解。用戶還可以從 MPI 內部利用分佈式計算環境，並指定
分析以在任何指定時間都可用的任何網路電腦上運行。
The Moldflow Plastics Insight suite of software is the world's leading
product for the in-depth simulations to validate part and mold design.
Companies around the world have chosen Moldflow's solutions because
they offer:
Unique, Patented Fusion Technology
MPI/Fusion, which is based on Moldflow's patented Dual Domain?
technology, allows you to analyze CAD solid models of thin-walled
parts directly, resulting in a significant decrease in model
preparation time. The time-savings allow you to analyze more design
iterations as well as perform more in-depth analyses.
Powerful Workflow and Productivity Tools
The user-friendly environments in MPI employ visualization and project
management tools that allow you to undertake extensive design analysis
and optimization. After your analyses are complete, you can produce
detailed, Web-ready design reports quickly and easily.
Proven Solutions for all Types of Applications
Moldflow's analysis products can simulate plastics flow and packing,
mold cooling, and part shrinkage and warpage for thermoplastic
injection molding, gas-assisted injection molding, co-injection
molding and injection-compression molding processes. Additional
modules simulate reactive molding processes including thermoset and
rubber injection molding, reaction injection molding (RIM), structural
reaction injection molding (SRIM), resin transfer molding, microchip
encapsulation and Underfill (flip-chip) encapsulation.
The World's Best 3D Solution
Using a proven solution technique based on a solid tetrahedral finite
element volume mesh, MPI/3D allows you to perform true 3-dimensional
flow simulations on parts that tend to be very thick and solid in
nature as well as those that have extreme changes from thin to thick.
The Widest Range of Supported Geometry Types
Moldflow's MPI technology can be used on all CAD model geometry types,
including traditional midplane models, wire frame and surface models,
thin-walled solids and thick or difficult-to-midplane solids.
Regardless of your design geometry, you can accomplish simulation
tasks in an easy-to-use, consistent, integrated environment that works
with your model.
Unsurpassed Network Computing Options
Moldflow Plastics Insight (MPI) has been developed with network
computing environments in mind. For example, users can run
MPI/Synergy, the pre- and post-processor, on user-friendly Windows PC
while running the analysis solvers on powerful UNIX workstations.
Users can also take advantage of a distributed computing environment
from within MPI and assign analyses to run on whatever network
computers are available at any given time.
